Tag Archives: Testbed

Chip-Scale Testbed Capabilities

CHIP-SCALE TESTING LABORATORY

The TOAN testbed facility has recently expanded its photonic devices testing facility into a dedicated lab: the CIAN Chip-Scale Testing Laboratory (CST).  The CST has the capability to characterize unpackaged passive and active photonic chips and is directly connected to TOAN testbed through single-mode fiber and gigabit-Ethernet.  This connectivity enables the insertion and evaluation of the unpackaged photonic chips on the network as a system. Pictures of the CST laboratory and a list of its capabilities are described below.

The CST facility supports characterization of passive waveguide devices as well as active devices such as lasers, modulators, transmitters and receivers.  Optical signals can be coupled on and off chip via lensed fibers, butt coupling, or other specialized means. Passive device characterization can be performed through all fiber-optic telecommunication bands. Active characterization includes S-parameter testing up to 67GHz, and BER and eye-diagram testing up to 32Gb/s.

For system-level testing, packet streams up to 40Gb/s can be flowed through the device, and the network’s ability to process the return streams with suitable latency, bit rates, and in accordance with the modulation schemes being run, can be evaluated. Continue reading