Author Archives: mitchellhr1

PHOTONICS PACKAGING ENGINEER

APIC Corporation delivers monolithically integrated photonic-electronic circuits, microprocessors, and reconfigurable fiber networks to DoD and Federal Agencies, which far exceed today’s capabilities at a fraction of the size, weight, power, and total ownership cost.

Location:  Culver City, CA

Job Description: 

Develop various fiber-optic, single-mode coupling schemes for photonics devices. Understand the interplay of various optical parameters, behavior and packaging materials, and implement continuous improvement of specifications

  •  The candidate must have a minimum of 3 years  experience with fiber-optic components, preferably relating to passive components used in the communication industry.
  •  M.S. Degree or PhD preferred in the related field.
  •  Experience in simple opto-mechanical systems, mechanical design ability preferred.
  •  Strong motivation to translate theory, ideas and designs into finished product, and manufacturable processes. Some background in lasers is a plus.

Excellent verbal and written communication skills are required. U.S. Citizenship or Permanent Resident status required. APIC has competitive salaries and benefits.

Apply Here

If you qualify and have interested in being considered for this position, please email a copy of your resume in MS Word or PDF format in confidence. (jc)