The recent OIDA/CIAN Workshop sponsored by IPIC and Go!Foton on March 19th, in Los Angeles, CA was a success!
The workshop was targeted at companies and innovators considering or already investing in integrated photonics to meet their future product requirements, and who need to understand key manufacturing challenges and how they can be addressed. Read more about the conference.
Key questions addressed included:
- What supply chain, manufacturing, and packaging challenges are common across applications?
- What common or standardized elements exist across applications?
- What resources are available and how can gaps be filled?
Also during the conference a poster judging competition took place. Three top posters were selected as winners.
1st Place Winner
Silicon photonic waveguides are typically designed to operate with the fundamental mode due to low cross talk with higher order modes and low propagation loss. However, currently, silicon photonics is being exploited for operation with higher order modes propagation for mode-division multiplexing (MDM). This approach utilizes the orthogonal modes of a waveguide by encoding information both in space and wavelength to augment bandwidth limited wavelength-division multiplexing (WDM) systems. Conventionally, ring resonators and grating structures are applied to achieve spatial modes conversion. In this paper, we explore an alternative approach to mode conversion using counter-directional resonators. We introduce a cavity into grating-assisted directional couplers, offering both flexibility in design and wavelength selectivity provided by resonant structures. Our compact (54.5 μm2) device is demonstrated experimentally to operate with resonant 1st and 2nd order guided TE-modes.
From the Winner
OIDA was a chance for me to visualize the hurdles that photonic startups are meeting. I learned about the opportunities that exist to bring a product to market and the prices associated with these products.
2nd Place Winner
This research focuses on bringing lithium niobate films-on-insulator (LNOI) to the foundry-fabricated silicon-on-insulator (SOI) platform. This is done by fabricating bonded SOI-LNOI integrated devices, mitigating thermal stresses in the bonded stack to allow for standard fabrication procedures, and creating a fully functioning PDK of hybrid Si-LN optical device components for third party users. This technology enables compact devices in LN and highly efficient nonlinear optical devices based in Si, both of which are unattainable with each standalone bulk material platform.
From the Winner
The OIDA workshop at OFC 2017 was an exceptional opportunity to hear of the different routes researchers in academia and industry are currently taking to grow integrated photonics from a low-production, manually-intensive industry into something akin to the booming industry that integrated electronics has been for the last five decades. I left the workshop with a feeling of profound fortune to have the chance to work in a field with such impressive men and women.
3rd Place Winner
This research is focused on developing silicon photonic subsystems for high-performance computers and data-center applications. To be able to integrate the silicon photonic technology and utilize its functionality, software-defined control planes ought to reconfigure their operation based on the network needs. Previously we developed a subsystem consisting of a fast tunable laser and a silicon photonic chip operating as a demultiplexer. The demonstrated FPGA-based controlled plane allowed the user to choose a desired wavelength of operation and spatial switching: unicast, multicast or broadcast. In the presented work at the OIDA we added another layer of a feedback control ensure thermal stability of our subsystem.
From the Winner
The industry speakers broaden my view on their take on the silicon photonic technology. Additional applications were presented along with commercialization challenges.