Pitch Reducing Optical Fiber Arrays
Date: Friday, April 1, 2016
Time: 2pm Pacific Time / 5pm East Coast Time
This presentation will introduce Chiral Photonics’ Pitch Reducing Optical fiber Arrays, or PROFAs. After registering, you will receive a confirmation email containing information about joining the webinar. View System Requirements
President and CEO
Chiral Photonics, Inc.
Dan Neugroschl received an MS in Materials Science from Columbia University in 1989. Dan was a researcher at IBM Research, Yorktown Heights from 1989-1991 in Advanced Packaging. He then served as VP of Operations and Advanced Development as a co-founder of Schick Technologies (currently Sirona Dental Systems), which develops and manufactures digital radiographic imaging systems for dentistry, from its inception in 1991 until 1998. He subsequently co-founded Chiral Photonics in 1999 and serves as its President and CEO. Chiral Photonics develops and manufactures fiber optic components in addition to offering photonic integrated circuit coupling and packaging services.
High density connections at optical interfaces are vital for photonic integrated circuits (PICs) with a large number of optical input and output channels and generally desirable to most optimally use valuable chip real estate and reduce waveguide propagation losses. This presentation will introduce Chiral Photonics’ Pitch Reducing Optical Fiber Arrays, or PROFAs, fiber optic couplers that enable low-loss input/output to PICs via both the die edge and surface. This presentation will focus on Chiral Photonics’ products and services related to PIC probing and packaging but will also touch on closely related PROFA offerings that enable multicore fiber fanouts, high power, pump-signal combiners and optical switches.